JPH0322569Y2 - - Google Patents

Info

Publication number
JPH0322569Y2
JPH0322569Y2 JP16230086U JP16230086U JPH0322569Y2 JP H0322569 Y2 JPH0322569 Y2 JP H0322569Y2 JP 16230086 U JP16230086 U JP 16230086U JP 16230086 U JP16230086 U JP 16230086U JP H0322569 Y2 JPH0322569 Y2 JP H0322569Y2
Authority
JP
Japan
Prior art keywords
leg
radiator grille
clip
fastener
flange
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP16230086U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6368506U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16230086U priority Critical patent/JPH0322569Y2/ja
Publication of JPS6368506U publication Critical patent/JPS6368506U/ja
Application granted granted Critical
Publication of JPH0322569Y2 publication Critical patent/JPH0322569Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Insertion Pins And Rivets (AREA)
JP16230086U 1986-10-24 1986-10-24 Expired JPH0322569Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16230086U JPH0322569Y2 (en]) 1986-10-24 1986-10-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16230086U JPH0322569Y2 (en]) 1986-10-24 1986-10-24

Publications (2)

Publication Number Publication Date
JPS6368506U JPS6368506U (en]) 1988-05-09
JPH0322569Y2 true JPH0322569Y2 (en]) 1991-05-16

Family

ID=31089432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16230086U Expired JPH0322569Y2 (en]) 1986-10-24 1986-10-24

Country Status (1)

Country Link
JP (1) JPH0322569Y2 (en])

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6855368B1 (en) 2000-06-28 2005-02-15 Applied Materials, Inc. Method and system for controlling the presence of fluorine in refractory metal layers
US6878206B2 (en) 2001-07-16 2005-04-12 Applied Materials, Inc. Lid assembly for a processing system to facilitate sequential deposition techniques
US6911391B2 (en) 2002-01-26 2005-06-28 Applied Materials, Inc. Integration of titanium and titanium nitride layers
US6916398B2 (en) 2001-10-26 2005-07-12 Applied Materials, Inc. Gas delivery apparatus and method for atomic layer deposition
US6936906B2 (en) 2001-09-26 2005-08-30 Applied Materials, Inc. Integration of barrier layer and seed layer
US6951804B2 (en) 2001-02-02 2005-10-04 Applied Materials, Inc. Formation of a tantalum-nitride layer
US6998579B2 (en) 2000-12-29 2006-02-14 Applied Materials, Inc. Chamber for uniform substrate heating
US7022948B2 (en) 2000-12-29 2006-04-04 Applied Materials, Inc. Chamber for uniform substrate heating
US7049226B2 (en) 2001-09-26 2006-05-23 Applied Materials, Inc. Integration of ALD tantalum nitride for copper metallization
US7085616B2 (en) 2001-07-27 2006-08-01 Applied Materials, Inc. Atomic layer deposition apparatus
US7101795B1 (en) 2000-06-28 2006-09-05 Applied Materials, Inc. Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer
US7201803B2 (en) 2001-03-07 2007-04-10 Applied Materials, Inc. Valve control system for atomic layer deposition chamber
US7211144B2 (en) 2001-07-13 2007-05-01 Applied Materials, Inc. Pulsed nucleation deposition of tungsten layers
US7262133B2 (en) 2003-01-07 2007-08-28 Applied Materials, Inc. Enhancement of copper line reliability using thin ALD tan film to cap the copper line
US7405158B2 (en) 2000-06-28 2008-07-29 Applied Materials, Inc. Methods for depositing tungsten layers employing atomic layer deposition techniques
US7429516B2 (en) 2002-02-26 2008-09-30 Applied Materials, Inc. Tungsten nitride atomic layer deposition processes
US7439191B2 (en) 2002-04-05 2008-10-21 Applied Materials, Inc. Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applications
US7501343B2 (en) 2000-06-27 2009-03-10 Applied Materials, Inc. Formation of boride barrier layers using chemisorption techniques
US7595263B2 (en) 2003-06-18 2009-09-29 Applied Materials, Inc. Atomic layer deposition of barrier materials

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4653289B2 (ja) * 2000-07-24 2011-03-16 株式会社浅間製作所 取付部材の着脱装置
JP4630259B2 (ja) * 2006-07-05 2011-02-09 株式会社パイオラックス クリップ
JP5611716B2 (ja) * 2010-08-16 2014-10-22 株式会社屋根技術研究所 板状モジュールの固定構造

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7501344B2 (en) 2000-06-27 2009-03-10 Applied Materials, Inc. Formation of boride barrier layers using chemisorption techniques
US7501343B2 (en) 2000-06-27 2009-03-10 Applied Materials, Inc. Formation of boride barrier layers using chemisorption techniques
US7033922B2 (en) 2000-06-28 2006-04-25 Applied Materials. Inc. Method and system for controlling the presence of fluorine in refractory metal layers
US7465666B2 (en) 2000-06-28 2008-12-16 Applied Materials, Inc. Method for forming tungsten materials during vapor deposition processes
US7405158B2 (en) 2000-06-28 2008-07-29 Applied Materials, Inc. Methods for depositing tungsten layers employing atomic layer deposition techniques
US7115494B2 (en) 2000-06-28 2006-10-03 Applied Materials, Inc. Method and system for controlling the presence of fluorine in refractory metal layers
US6855368B1 (en) 2000-06-28 2005-02-15 Applied Materials, Inc. Method and system for controlling the presence of fluorine in refractory metal layers
US7101795B1 (en) 2000-06-28 2006-09-05 Applied Materials, Inc. Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer
US6998579B2 (en) 2000-12-29 2006-02-14 Applied Materials, Inc. Chamber for uniform substrate heating
US7022948B2 (en) 2000-12-29 2006-04-04 Applied Materials, Inc. Chamber for uniform substrate heating
US7094680B2 (en) 2001-02-02 2006-08-22 Applied Materials, Inc. Formation of a tantalum-nitride layer
US6951804B2 (en) 2001-02-02 2005-10-04 Applied Materials, Inc. Formation of a tantalum-nitride layer
US7201803B2 (en) 2001-03-07 2007-04-10 Applied Materials, Inc. Valve control system for atomic layer deposition chamber
US7211144B2 (en) 2001-07-13 2007-05-01 Applied Materials, Inc. Pulsed nucleation deposition of tungsten layers
US6878206B2 (en) 2001-07-16 2005-04-12 Applied Materials, Inc. Lid assembly for a processing system to facilitate sequential deposition techniques
US7085616B2 (en) 2001-07-27 2006-08-01 Applied Materials, Inc. Atomic layer deposition apparatus
US7049226B2 (en) 2001-09-26 2006-05-23 Applied Materials, Inc. Integration of ALD tantalum nitride for copper metallization
US7494908B2 (en) 2001-09-26 2009-02-24 Applied Materials, Inc. Apparatus for integration of barrier layer and seed layer
US6936906B2 (en) 2001-09-26 2005-08-30 Applied Materials, Inc. Integration of barrier layer and seed layer
US6916398B2 (en) 2001-10-26 2005-07-12 Applied Materials, Inc. Gas delivery apparatus and method for atomic layer deposition
US7473638B2 (en) 2002-01-26 2009-01-06 Applied Materials, Inc. Plasma-enhanced cyclic layer deposition process for barrier layers
US6911391B2 (en) 2002-01-26 2005-06-28 Applied Materials, Inc. Integration of titanium and titanium nitride layers
US7094685B2 (en) 2002-01-26 2006-08-22 Applied Materials, Inc. Integration of titanium and titanium nitride layers
US7429516B2 (en) 2002-02-26 2008-09-30 Applied Materials, Inc. Tungsten nitride atomic layer deposition processes
US7439191B2 (en) 2002-04-05 2008-10-21 Applied Materials, Inc. Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applications
US7262133B2 (en) 2003-01-07 2007-08-28 Applied Materials, Inc. Enhancement of copper line reliability using thin ALD tan film to cap the copper line
US7595263B2 (en) 2003-06-18 2009-09-29 Applied Materials, Inc. Atomic layer deposition of barrier materials

Also Published As

Publication number Publication date
JPS6368506U (en]) 1988-05-09

Similar Documents

Publication Publication Date Title
JPH0322569Y2 (en])
JPH0155681B2 (en])
JPS6261804B2 (en])
JPS6217410A (ja) ２枚のパネルを接面状に止着するための留め具
JPS6329927Y2 (en])
US6430778B1 (en) Apparatus for hingedly connecting a cabinet door to a cabinet wall of a frameless cabinet
JPH0413450Y2 (en])
JPH09280217A (ja) 固定具
JP2605817Y2 (ja) 部品の取付構造
JPS6218722Y2 (en])
JP2518056Y2 (ja) 吊 子
JP2585648Y2 (ja) 浴槽エプロンの取付構造
JPH0633158Y2 (ja) 引手取付け装置
JPH0218746Y2 (en])
JPH038739Y2 (en])
JPS632649Y2 (en])
JPH039236Y2 (en])
JPH0422714Y2 (en])
JPH01166806U (en])
JPH0647061Y2 (ja) 天井野縁材の吊下げ構造
JP2552581Y2 (ja) 車両部品取付用クリップ
JPH0234195Y2 (en])
JPS5934678Y2 (ja) 天井等における回り縁着脱装置
JPH0632493Y2 (ja) クリップ
JPH0726566Y2 (ja) 部品の取付構造